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Molybdenum Disulfide – Paving the way for Future Electronic and Thermal Devices

AUTHOR: TIME:2019-09-11 CLICK:507
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Molybdenum Disulfide – Paving the way for Future Electronic and Thermal Devices

Molybdenum Disulfide (MoS2) is widely known for its excellent lubricating properties. It has a low co-efficient of friction. It has the ability to operate in a variety of temperatures up to 600oF. When combined with resigns or binders, molybdenum disulfide can also be very effective in preventing corrosion.


The versatility of this coating has made MoS2 a popular choice among research facilities for experiments to find more conducive coatings. Recently, such a breakthrough was reached at Kansas State University.


A Breakthrough on Application of Molybdenum Disulfide


A team of scientists and researchers from the chemical engineering department manipulated the composition of molybdenum disulfide with gold atoms. By doing so, they found that the electrical characteristics of MoS2 improved significantly. The team then used MoS2 to experiment with the functioning of transistors. By combining the lubricant with gold nano-materials, they were able to improve transistor-rectification.

They also conducted the same experiment using graphene, a single-atom-thick sheet of carbon atoms, and boron-nitride, a chemical compound comprising boron and nitrogen atoms. However, they did not get the same results as they did with MoS2.

The scientists believe that thermally controlled interfacing of noble metals with MoS2’s dichalcogenide layers can be used to enhance characteristics of future devices such as pseudo-mobility, phonon-transport, carrier concentration, and transport-barriers.

Researchers also hope that molybdenum disulfide atomic thick structure can be used to create future electronic and thermal devices that will be only a few atoms thick. The findings also provide data that MoS2 can be used to significantly reduce the power consumption of such devices.

These research findings could lead to thermally conductive coatings, better sensors, transistors, as well as extremely fast and ultrathin logic and plasmonics devices.


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